TSMC, Intel, Samsung, all of these companies are chip manufacturing companies, which have extensive know-how in chip design, processing, building, and integrating them, but instead of concentrating on the front end of the semiconductor production process, they are now concentrating on the rear end, or packaging, process. Chip packaging is becoming increasingly important as chipmakers attempt to gain an advantage in a highly competitive industry. A chip’s capacity for transistors is limited, thus manufacturers are increasingly attempting to maximize their products’ performance by arranging and stacking chips in various forms.